Basic Info.
Model NO.
Sn62.8Pb36.8Ag0.4 Solder Paste
Base Material
FR-4
Certification
ISO
Customized
Customized
Condition
New
Alloy
Tin Lead
Powder Size
Type 3: 25 to 45 Microns
Powder Size 2
Type 4: 20 to 38 Microns
Flux
No Clean Flux
Alloy 2
Sn63pb37
Alloy 3
Sn60pb40
Alloy 4
Sn55pb45
Alloy 5
Sn50pb50
Packing
Jar
Packing 2
Syringe
Shipping
Courier / Air Freight
Shelf Life
6months
Storage
0 to 10 Degree Celsius
Application
SMT
Application 2
SMD
Transport Package
Foam Box
Specification
100g to 1000g
Trademark
XF Solder
Origin
China
HS Code
3810100000
Production Capacity
30tons/Month
Packaging & Delivery
Package Size
10.00cm * 10.00cm * 10.00cm
Package Gross Weight
1.000kg
Product Description
T3 T4 PCB LED Reballing Printing Soldering Solder Paste Sn62.8Pb36.8Ag0.4
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc
Applications of Tin Lead Solder Paste Sn63Pb37 63 37:
Sn63Pb37 solder paste can be used in the assembly of consumer electronic products such as smartphones, tablets, laptops, TVs, and audio equipment, LED lighting products etc.
Tin lead solder paste 63 37 can be used in many automotive electronic control units (ECUs), sensors, and modules are assembled using Sn63Pb37 solder paste.
It can be used in industrial electronics such as Industrial automation systems, control panel, solar panels etc.
General soldering and repairing works for small projects or for hobbyist.
How to use Tin Lead Solder Paste Sn63Pb37 63 37?
Stencil Printing: Prepare and clean stencil and PCB properly. Using a squeegee, a stencil printer, or a similar tool, apply the solder paste 63 37 over the stencil, allowing the paste to be pushed through the openings and onto the PCB pads. Apply even pressure to ensure consistent solder paste deposition.
Place IC Components: Precisely place surface mount components onto the solder paste-covered pads. Ensure that the component leads or pads align correctly with the solder paste deposits.
Reflow Soldering: Place the PCB with the components onto a conveyor belt in a reflow oven or onto a hot plate for reflow soldering. The reflow process involves heating the PCB to melt the solder paste 63 37 and create solder joints. Follow the reflowing manual for reflow temperature profiles and times.
Instruction on Storage and Using of Tin Lead Solder Paste Sn63Pb37 63 37:
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc
Applications of Tin Lead Solder Paste Sn63Pb37 63 37: Sn63Pb37 solder paste can be used in the assembly of consumer electronic products such as smartphones, tablets, laptops, TVs, and audio equipment, LED lighting products etc.
Tin lead solder paste 63 37 can be used in many automotive electronic control units (ECUs), sensors, and modules are assembled using Sn63Pb37 solder paste.
It can be used in industrial electronics such as Industrial automation systems, control panel, solar panels etc.
General soldering and repairing works for small projects or for hobbyist.
How to use Tin Lead Solder Paste Sn63Pb37 63 37?
Stencil Printing: Prepare and clean stencil and PCB properly. Using a squeegee, a stencil printer, or a similar tool, apply the solder paste 63 37 over the stencil, allowing the paste to be pushed through the openings and onto the PCB pads. Apply even pressure to ensure consistent solder paste deposition.
Place IC Components: Precisely place surface mount components onto the solder paste-covered pads. Ensure that the component leads or pads align correctly with the solder paste deposits.
Reflow Soldering: Place the PCB with the components onto a conveyor belt in a reflow oven or onto a hot plate for reflow soldering. The reflow process involves heating the PCB to melt the solder paste 63 37 and create solder joints. Follow the reflowing manual for reflow temperature profiles and times.
Instruction on Storage and Using of Tin Lead Solder Paste Sn63Pb37 63 37:
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
